HATS™ & HATS²™ Resources

HATS™ Via Reliability Testing Technology has been in use since 2003 and has more than 9,000 coupon designs in the field. HATS²™ Technology was released in 2020 to reflect changes in via test structures and test methodologies. Over the years, a number of papers have been published regarding the technology and its benefits. Click on the links below to read the HATS²™ FAQ's or download an example of the test report generated by the system or a sampling of papers that have been published regarding HATS™ & HATS²™ technology.

HATS™ & HATS²™ Articles

 
HATS²™ Micro Via Study for IPC/imec/ESA
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A New Cost Effective Technique for Accelerated PCB Testing
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Highly Accelerated Thermal Shock (HATS™) Testing for PCB Hole Reliability
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Process Survivability, Reliability and Robustness Testing for EVs
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Reliability of PB-Free Printed Circuit Boards
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Evaluating Laminates for High Temperature Assembly
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HATS²™ Press Coverage

 
High Speed Via Reliability Testing Using Updated HATS² Technology
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Via Reliability and Robustness in Today’s Environment
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* U.S. Patent 10,379,153. German Patent 10 2019 006 553.0. Japanese Patent 7,291,045. Chinese Patent ZL 201922142627.1. Worldwide Patents Pending.
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