Stacks Image 2313

HATS²™ Single Via Coupons with 7 Single Via Nets and press-fit connections to allow for multiple cycle Reflow Simulation. 36 of these (252 Test Nets) can fit into a HATS™ machine updated with HATS²™ technology.

Stacks Image 2317

HATS²™ Single Via Coupons with 6 Single Via Nets and one Daisy-chain (Net 1). Coupons contain press-fit connections to allow for multiple cycle Reflow Simulation. 36 of these HATS²™ Single Via Coupons (252 Test Nets) can fit into a HATS™ machine updated with HATS²™ technology.

Stacks Image 2335

IPC-2221B Type "D" Coupons with 2 Daisy-chain Nets and press-fit connections to allow for multiple cycle Reflow Simulation. 72 of these IPC "D" coupons (144 Test Nets) can fit into a HATS™ machine updated with HATS²™ technology.

Stacks Image 2326

Traditional HATS™ Coupons with 4 Daisy-chain Nets. Soldered connections can be used for Thermal Shock/Cycling and Press fit connectors can be used to allow for multiple cycle Reflow Simulation in a HATS™ machine updated with HATS²™ technology. 36 of these (144 Test Nets) can fit into a HATS™ machine with (Reflow & Shock/Cycling) or without (Shock/Cycling Only) the update for HATS²™ technology.

HATS²™ Technology was released in 2020 to update HATS™ test systems to add the capability to perform multiple cycle Convection Reflow Simulation up to 260C in accordance with IPC-TM-650 Method 2.6.27B and other customer based reflow profiles. This Convection Reflow Simulation Methodology with In-Situ resistance measurements can detect cracks and separations in the via structures that occur during the high heat/expansion of convection reflow which could reconnect mechanically at lower temperatures and not be detectable. For more specific information regarding HATS™ and HATS²™ technology, please visit our FAQ page under the RESOURCES heading.

HATS²™ Technology also updates HATS™ systems with improved measurement subsystems capable of high-current, micro-ohm precision, 4-wire resistance measurement capability. This allows updated HATS™ units to test the patented* HATS²™ Single Via Test Coupon. This updated measurement subsystem also allows HATS™ units to be able to test up to 72 of the IPC-2221B Type "D" coupons and 36 Traditional or Single Via HATS™ coupons for both multiple cycle Convection Oven Reflow Simulation and Thermal Shock/Cycling. For more information about the patented* HATS²™ Single Via Test Coupon, please visit our dedicated HATS²™ Single Via page which can be found under the HATS²™ Technology heading.

HATS²™ Technology also updates HATS™ systems with new reporting software that allows customers to gain a clear understanding of test results both graphically and in tables. For more information, please view an EXAMPLE REPORT which can be found under the RESOURCES heading.

* U.S. Patent 10,379,153. German Patent 10 2019 006 553.0. Chinese Patent ZL 201922142627.1. Worldwide Patents Pending.

Copyright © 2016-2023 - Robert Neves - All Rights Reserved