HATS²™ Technology was released in 2020 to update HATS™ test systems to add the capability to perform multiple cycle Convection Reflow Simulation up to 260C in accordance with IPC-TM-650 Method 2.6.27B and other customer based reflow profiles. This Convection Reflow Simulation Methodology with In-Situ resistance measurements can detect cracks and separations in the via structures that occur during the high heat/expansion of convection reflow which could reconnect mechanically at lower temperatures and not be detectable. For more specific information regarding HATS™ and HATS²™ technology, please visit our FAQ page under the RESOURCES heading.
HATS²™ Technology also updates HATS™ systems with improved measurement subsystems capable of high-current, micro-ohm precision, 4-wire resistance measurement capability. This allows updated HATS™ units to test the patented* HATS²™ Single Via Test Coupon. This updated measurement subsystem also allows HATS™ units to be able to test up to 72 of the IPC-2221B Type "D" coupons and 36 Traditional or Single Via HATS™ coupons for both multiple cycle Convection Oven Reflow Simulation and Thermal Shock/Cycling. For more information about the patented* HATS²™ Single Via Test Coupon, please visit our dedicated HATS²™ Single Via page which can be found under the HATS²™ Technology heading.
HATS²™ Technology also updates HATS™ systems with new reporting software that allows customers to gain a clear understanding of test results both graphically and in tables. For more information, please view an EXAMPLE REPORT which can be found under the RESOURCES heading.
* U.S. Patent 10,379,153. German Patent 10 2019 006 553.0. Chinese Patent ZL 201922142627.1. Worldwide Patents Pending.
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