HATS™ & HATS²™ Articles

Process Survivability, Reliability and Robustness Testing for EVs

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Reliability of PB-Free Printed Circuit Boards

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Evaluating Laminates for High Temperature Assembly

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HATS ² ™ Micro Via Study for IPC/imec/ESA

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A New Cost Effective Technique for Accelerated PCB Testing

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Highly Accelerated Thermal Shock (HATS™) Testing for PCB Hole Reliability

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HATS²™ Press Coverage

High Speed Via Reliability Testing Using Updated HATS² Technology

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Via Reliability and Robustness in Today’s Environment

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* U.S. Patent 10,379,153. German Patent 10 2019 006 553.0. Japanese Patent 7,291,045. Chinese Patent ZL 201922142627.1. Worldwide Patents Pending.

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