The IPC's Microvia Task Group commissioned a test program to study the impact of various 3 layer microvia structures. This test report encompasses Soldering Process Survivability Testing, Reliability Testing and Robustness Testing performed using a HATS²™ tester. This test highlights the wide range of capabilities that the HATS²™ tester is capable of using both IPC "D" coupons and the patented HATS²™ Single Via Coupon*. Below is the video presentation made at the IPC Apex Expo Technical Conference in 2021 along with links to a PDF of the presentation itself along with the complete report the presentation was based upon.