Microvia technology is notorious for a latent and intermittent open circuit failure that is difficult to screen. Read how to Quickly Screen out this issue with a new methodology.
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Remember this video from the 80s showing a "Reliability Test"? This is really a "Robustness Test". This article will go over the differences between Process Survivability, Reliability & Robustness.
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The Case for Moving On From Using Microsectioning as the Way to Assess Reliability of Via Structures.
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Happy Holden Talks about Registration and the Coupons and Tools Available to Assess Registration and Performance.
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New products, new designs, but still the age-old question persists, “How long will a PCB live and what will a PCB quality of life be?”
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Electric vehicles include Trains, Subways, Ships, Motorcycles, Scooters, Skateboards, and even Aircraft. This article talks about the unique testing needs for EV's.
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An Interview with Bob Neves by Nolan Johnson talking about Testing Requirements and the Changing Market.
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An Interview of Andrew Anisbitt and Bob Neves by Barry Matties talking about HATS²™ Technology and it's Impact on Reliability.
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The IPC's Microvia Task Group commissioned a test program to study the impact of various 3 layer microvia structures. This test report encompasses Soldering Process Survivability Testing, Reliability Testing and Robustness Testing performed using a HATS²™ tester.
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An Interview that Appeared in SMT007 About Robustness vs. Relaibility Testing.
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An SMT 007 Press Release on High Speed Via Reliability Testing Using Updated HATS² Technology.
A complete test system that gives you insight into the expected performance and reliability of the PCBs and Substrates going into your electronic products
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* U.S. Patent 10,379,153. German Patent 10 2019 006 553.0. Japanese Patent 7,291,045. Chinese Patent ZL 201922142627.1. Worldwide Patents Pending
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