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The HATS²® Test System

HATS²™ Micro Via Study for IPC/imec/ESA

By Bob Neves - Presented at the IPC Apex/Expo Conference March 2021

The IPC's Microvia Task Group commissioned a test program to study the impact of various 3 layer microvia structures. This test report encompasses Soldering Process Survivability Testing, Reliability Testing and Robustness Testing performed using a HATS² tester.

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HATS² and the HATS² logo are registered trademarks of Reliability Assessment Solutions Inc.,
registered with the United States Patent and Trademark Office and internationally under the Madrid Protocol.
Copyright © 2016-2026 - Robert Neves - All Rights Reserved

* U.S. Patent 10,379,153. German Patent 10 2019 006 553.0. Japanese Patent 7,291,045. Chinese Patent ZL 201922142627.1. Worldwide Patents Pending

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