Test Equipment for Assessing the Reliability, Robustness and Component Attachment Process Survivability of Via Structures

 
TESTING OF IPC-2221B TYPE "D", HATS²™ SINGLE VIA COUPONS*, SUBSTRATE & CUSTOM COUPONS OF UP TO 7 TEST NETS
72 COUPON CAPACITY WITH UP TO 7 TEST NETS / COUPON
 
72 IPC "D" or 36 HATS²™ SINGLE VIA*/CUSTOM COUPON TEST CHAMBER CAPACITY
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AIR-TO-AIR THERMAL SHOCK COMPLIANT WITH IPC-TM-650 METHOD 2.6.7.2C
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RAPID TEMPERATURE CYCLES OR CUSTOM PROFILES BETWEEN -65°C TO +265°C
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REDUCED THERMAL SHOCK CYCLE TIMES BY 60 TO 80% (~1000 CYCLES PER WEEK)
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CONVECTION REFLOW ASSEMBLY SIMULATION COMPLIANT WITH IPC-TM-650 METHOD 2.6.27B WITH IN-SITU RESISTANCE MONITORING
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BUILT-IN REFLOW PROFILER ALLOWS ANY REFLOW CYCLE TO BE SIMULATED AUTOMATICALLY
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ROBUSTNESS TESTING OF UNLIMITED CONSECUTIVE REFLOW CYCLES OR ANY CYCLE FROM -65°C TO 265°C
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HATS™ & HATS²™ TEST SERVICES AVAILABLE AROUND THE WORLD
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DETAILED GRAPHICAL TEST REPORT INCLUDING BOX PLOTS
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Reliability Assessment Solutions (RAS) is the Manufacturer,
Patent Holder and Licensee of HATS™ & HATS²™ Technology

HATS²™ Test Systems are available for purchase from
Reliability Assessment Solutions (RAS)

* U.S. Patent 10,379,153. German Patent 10 2019 006 553.0. Japanese Patent 7,291,045. Chinese Patent ZL 201922142627.1. Worldwide Patents Pending.
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